Thick diamond cutter processing methods are: mechanical grinding, polishing hot metal plate, ion beam, laser beam and plasma etching.
Diamond sintered flat cutting disc body tool 2.3
The diamond thick film processing methods using a rolling average particle size of abrasive damage to the diamond grains of 32 ~ 37μm or directly obtained using Method HPHT diamond grains, grain powder piled on the WC-16wt% Co alloy, and then Ta foil to isolate and sintered at 5.5GPa, 1500 ℃ for 60 minutes to prepare a diamond sintered body, the sintered body with the tools with high wear resistance.
2.4 monocrystalline diamond tool
Single-crystal diamond cutter diamond crystal is usually the head of fixed knife, knife head with a screw or plate fixed on the Tool Bar. Diamond knife fixing method in the head are: mechanical reinforcement method (pressing surface and the bottom surface of the polished diamond with the knife head is fixed to the pressing plate); powder metallurgy (diamond in the alloy powder by adding the pressure in the vacuum sintering, the diamond knife reinforced concrete cutting wheels head is fixed); bonding and brazing (using an inorganic adhesive or other adhesive fixing diamond). Since the thermal expansion coefficient of diamond and matrix disparity, diamond easy to loose.
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